Automatic lift-off device (metal resist stripping) Lift-off
Amazing peeling ability with high-pressure jets! Our unique special nozzle enables high-speed processing, high peeling power, and lift-off with low chemical consumption using sheet materials!
Physical and chemical W (double) effect lift-off! What is W effect lift-off? - Delamination using high-pressure jets (MAX 20MPa) with our unique special nozzle for physical force - Delamination using organic solvents such as NMP and DMSO for chemical force Additionally, it achieves high-speed processing, high delamination power, and high stability with sheet processing, while also reducing the amount of chemical solution used. It can also be used as a cleaning device for resist, polymers, and masks, capable of delaminating stubborn resist after thermal treatment or dry etching. Moreover, there is no re-adhesion of burrs or metals, which is a problem in DIP processing. This high-pressure jet lift-off device is suitable for patterning thick films that are difficult to etch, such as thick metal and oxide films. 【Features】 ■ Amazing delamination capability with W (double) effect lift-off! ■ Process stability with sheet-type processing ■ Removal of burrs during lift-off ■ No re-adhesion ■ Temperature-controlled chemical recycling system (optional) *For more details, please refer to the catalog or feel free to contact us.
- Company：エイ・エス・エイ・ピイ
- Price：Other
